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| redistribution layer ： ウィキペディア英語版 |
redistribution layer
A Redistribution Layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations.
==Introduction==
When an integrated circuit is manufactured, it usually has a set of IO pads that are wirebonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables you to bond out from different locations on the chip, making chip-to-chip bonding simpler.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
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